Responsibilities

• Introduce customer’s new product to FAB and support in new product’s tape out procedures to ensure pilot success.
• Improve new Product yield and ensure mass production inline, WAT and CP yield stable
• Define standard operation procedure for daily job
• Co-work with module engineers to solve production related issues. (inline, WAT, yield and reliability…)
• Co-work with module engineers to develop customized process to meet customer special requirement

Requirements

• Possess at least a bachelor’s degree in Electronic Engineering, Electrical Electronic Engineering, Physics, Material Science
• Study in specialized in wafer chip or related semiconductor course
• Possess good communication skills
• Possess good time management skills as well as a strong sense of commitment
• Semiconductor device process engineer background is preferred
• Semiconductor foundry experiences is preferred

We regret that only shortlisted candidates will be notified.
GMP Technologies (S) Pte Ltd | EA Licence: 11C3793 | EA Personnel: Fiona Koh | Registration No: R1109239